In a paper presented at PCIM 2015 Georges Tchouangue, Chief Engineer, Discrete Marketing – Power Semiconductors Toshiba Electronics Europe GmbH explores the power of new packaging designs that promise a 26% reduction of thermal resistance (Rth) alongside a 25% reduction of the package electrical resistance.

Download the paper to learn about how DSOP Advance packages deliver Innovative heat radiation performance and low package electrical resistance through:

• Package structure
• Thermal resistance
• Electrical characteristics

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